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Schlieren Thermal Mapper—Hardware Components

Introduction

Schlieren Imaging Fundamentals

Specifications

Our Schlieren Thermal Mapper (STM) optical head uses state-of-the-art construction techniques to produce the highest quality opto-electronic instrument:

Modular Opto-Electronic Design  
The design begins with an exclusive, modular opto-mechanical approach. Our modular design is based on a time-honored technique for opto-mechanical manufacturing that produces solid, stable construction. Modular design facilitates customization and upgrades to the optical package. Minor changes to the optical system do not imply major cost impacts when modular techniques are applied.

Long-working distance objectives are exclusively used in our optical heads. Objectives from 1X to 100X are available. The shortest working distance for this family of objectives is 12 millimeters.

The STM imaging instrument uses a high-resolution CCD camera with mega-pixel image format and 10-bit pixel depth. This camera is coupled with a proprietary high-brightness, optical source to produce diffraction-limited imagery without degradation from speckle and interference fringes found in typical laser/CCD imaging systems.

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Optical head with long-working distance objectives

Optical head mounted in Karl Suss PM 8 probe station

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Standard and Optional Staging
Our standard configuration consists of the optical head combined with a Karl Suss PM8 probe station. This combination yields a highly flexible system for optical and electrical examination of wafers, dice, and packaged integrated circuits (IC). All controls for the optical head and stage are computer automated, allowing for completely hands-free operation. Optometrix’s OptoVision software provides instrument control, navigation, image acquisition, and processing software.

Custom options include horizontal or inverted mounting with full XYZ staging for interfacing to test heads. These options include state-of-the-art translation stages with 0.1 micron positioning accuracy and vibration control systems.

  

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Installed system with integrated light tight hood and vibration isolation table.

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Modular Electronics Design
 Each instrument is provided with a state-of-the-art computer control and data acquisition system. Additional electronics are contained in a standard 19-inch rack-mount chassis. The electronics chassis is based on a standard bus configuration with plug-in cards for the major functions. This modular design allows for easy repair, customization, and future upgrades.

 

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Computer console with side-rack
mount option

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