The table below summarizes the capabilities of each technique
Technique
Physics
Failure Analysis Applications
OBIC
Photovoltaic effect
Location of junction defects
LIVA
Photoconductive effect
Location of open junctions and substrate damage
SEI
Seebeck (Thermal voltaic or thermal couple) effect
Location of opens
TIVA
Thermal-conductive effect
Location of shorts, vias with incorrect resistance
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