The table below summarizes the capabilities of each technique

Technique

Physics

Failure Analysis Applications

OBIC

Photovoltaic effect

Location of junction defects

LIVA

Photoconductive effect

Location of open junctions and substrate damage

SEI

Seebeck (Thermal voltaic or thermal couple) effect

Location of opens

TIVA

Thermal-conductive effect

Location of shorts, vias with incorrect resistance

Laser Signal Injection Microscope Laser Scanning Fundamentals cont.

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